0769-8572 8781
在半导体湿法工艺领域，精度和效率至关重要。CPH-P38-180/220-15-A T200 N2 加热器专为清洁后干燥任务而设计，可替代热系统中的传统浸入式加热器和加热器包裹管，有效降低系统成本和复杂性。此加热器以高功率密度优势专为峰值系统性能设计，确保最佳效率和快速响应时间。其功率调节模块便于调节出风口温度，可高达200°C，通过先进印刷技术实现均匀热传递，是晶圆快速干燥和旋转IPA干燥工艺的理想选择。
Precision and efficiency are critical in semiconductor wet processing. The CPH-P38-180/220-15-A T200 N2 heater, engineered for post-cleaning drying and reducing costs and complexity in thermal system. Its high power density ensures optimal efficiency and quick response. The adjustable power module controls outlet temperatures up to 200°C, and advanced printing technology achieves uniform heat distribution. Ideal for rapid wafer drying and rotary IPA processes.
1. **先进加热技术**：
- 采用最先进的加热管，实现快速高效的加热。
2. **增强的安全功能**：
- 通过过热保护探头和 K 型热电偶增强安全性（建议保护值设置为 200°C）。 具有保护管、螺纹导向通道和双支撑底座，可确保安全安装。
3. **精密控制系统**：
- 燃气压力调节器、节流阀、流量计、燃气流量监测、过温保护检测、出口温度检测、负载输出和温控功率调制模块，实现精确、方便的控制。
1. **Advanced Heating Technology**:
- Utilizes state-of-the-art heating tubes for rapid and efficient heating.
2. **Enhanced Safety Features**:
- Enhanced safety with overheat protection probes and K-type thermocouples (recommended protection value set at 200°C). Features protective tubes, threaded guide channels, and a dual-support base for safe installation.
3. **Precision Control System**:
- Gas pressure regulators, throttle valves, flow meters, gas flow monitoring, over-temperature protection detection, outlet temperature detection, load output, and temperature control power modulation module for precise, accessible control.
化学气相沉积（CVD）：在CVD过程中，氮气加热器用于维持反应腔室的温度，确保化学反应的均匀性和效率。
物理气相沉积（PVD）：PVD过程中，氮气加热器帮助控制沉积环境的温度，对薄膜的质量和一致性至关重要。
快速热处理（RTP）：在RTP中，氮气加热器能够提供快速而均匀的加热，对提高晶圆表面质量和微结构的控制至关重要。
退火过程：在晶圆退火步骤中，氮气加热器用于提供控制的热环境，有助于改善材料特性和电子性能。
清洗和干燥：在清洗晶圆后，氮气加热器可以用于干燥过程，以防止水痕和污染。
光刻后烘烤：光刻步骤后，使用氮气加热器进行烘烤，以固化光刻胶，提高图案的精确度。
晶圆快速干燥：通过氮气流快速吹扫晶圆表面，快速干燥减少水分造成的污染或晶圆表面的损伤。
旋转IPA干燥工艺：晶圆在IPA蒸汽中旋转，使用加热过的氮气流吹扫，以去除IPA和水分，从而实现干燥。这种方法特别适用于去除最后的水痕，并且可以提供非常干净、无残留物的干燥表面。
备注：氮气加热器的应用不仅局限于半导体行业，还广泛用于汽车制造（涂装、干燥和热处理），医药生产（药品制造中的干燥、杀菌和热处理），塑料和聚合物加工（高洁净塑料成型、挤出和复合材料加工），以及实验室和科研领域的精密温度控制。
Chemical Vapor Deposition (CVD): In the CVD process, maintain the temperature of the reaction chamber, ensuring uniformity and efficiency of the chemical reactions.
Physical Vapor Deposition (PVD): During the PVD process, help control the temperature of the deposition environment, crucial for the quality and consistency of the film.
Rapid Thermal Processing (RTP): In RTP, provide rapid and uniform heating, critical for enhancing the quality and microstructure of the wafer surface.
Annealing Process: In the wafer annealing step, offer a controlled thermal environment, aiding in the improvement of material properties and electronic performance.
Cleaning and Drying: Post-wafer cleaning, nitrogen heaters are used in the drying process to prevent watermarks and contamination.
Post-Lithography Baking: After the lithography step, use for baking, solidifying the photoresist and improving pattern precision.
Rapid Wafer Drying: Rapidly dries wafers by blowing nitrogen gas over the surface, minimizing contamination or damage due to moisture.
Rotary IPA Drying Process: Wafers are rotated in IPA vapor, and heated nitrogen gas is blown to remove IPA and moisture, achieving a clean, residue-free dry surface. This method is particularly suitable for removing the last traces of water and providing a very clean, residue-free dry surface.
Remarks:Nitrogen heaters can be used in many situations including automotive manufacturing (coating, drying, heat treatment), pharmaceutical production (drying, sterilization, heat processing), plastics and polymer processing (molding, extrusion, composite fabrication), and for precision temperature control in laboratories and research.
