说明：我们提供多种材料选项(PFA Teflon, ECTFE Halar, PVDF, 304L 不锈钢，316不锈钢，天然聚丙烯），以满足客户的特定需求。每种材料都具有不同的化学特性和耐用性，可以根据应用要求进行选择。

A range of material options (PFA Teflon, ECTFE Halar, PVDF, 304L stainless steel, 316 stainless steel, natural polypropylene) is provided to meet specific customer needs. Each material exhibits distinct chemical properties and durability, enabling selection based on application requirements.

说明：我们可以根据客户的要求定制各种尺寸和形状的产品，以确保完全符合其应用的空间和设计要求。
（1）基板间距/节距：
说明：我们可以调整基板之间的间距或节距，以适应不同类型的基板和工艺要求。这有助于优化制程和产品性能。
（2）基材接触点：
说明：客户可以指定基材接触点的位置和数量，以满足其特定的应用需求。这种个性化能够确保最佳性能和可靠性。
（3)侧开型材：
说明：我们提供侧开型材选项，以便于更容易地安装和维护设备。这有助于提高操作的便捷性。
（4）基材方向：
说明：客户可以选择基材方向，以适应其设备或工艺流程的方向性要求。这有助于确保产品的完美适配。
（5）混合基材尺寸：
说明：我们支持混合基材尺寸的定制，以满足不同部分的不同需求，同时确保整体性能和稳定性。
（6）设备自动化特点：
说明：我们的产品可以集成自动化特性，以提高操作效率和一致性。这包括自动装载、传送和控制功能。
（7）包埋盒处理功能：
说明：我们提供包埋盒处理功能，以确保在特定工艺步骤中的材料处理和保护。这有助于防止材料受到污染或损害。
（8）可拆卸手柄：
说明：我们的产品设计中包括可拆卸手柄，使其更易于携带、安装和维护。这提供了更大的便捷性和灵活性。

Wafer Cassettes can be customized in various sizes and shapes according to customer requirements, ensuring full compliance with the spatial and design specifications of their application.
• Substrate Spacing/Pitch: Description: We can adjust the spacing or pitch between substrates to accommodate different types of substrates and process requirements, contributing to optimized processes and product performance.
• Substrate Contact Points Customers can specify the position and quantity of substrate contact points to meet their specific application needs. This level of personalization ensures optimal performance and reliability.
• Side Opening Profiles We offer side opening profile options for easier installation and maintenance of equipment, enhancing operational convenience.
• Substrate Direction Customers can select the substrate direction to align with the directional requirements of their equipment or process flow, ensuring perfect product fit.
• Mixed Substrate Sizes We support customization of mixed substrate sizes to fulfill the varying requirements of different parts while ensuring overall performance and stability.
• Equipment Automation Features Our products can integrate automation features to enhance operational efficiency and consistency, encompassing automatic loading, transfer, and control functions.
• Embedding Box Processing Function We offer embedding box processing capabilities to ensure material handling and protection during specific process steps, mitigating the risk of material contamination or damage.
• Detachable Handles Our product design includes detachable handles, facilitating easier carrying, installation, and maintenance, thereby offering greater convenience and flexibility.

(1)金属剥离：
(2)化学镀：
(3)均匀蚀刻：
(4)最大限度地减少第一片晶圆的影响：
(5)改进的 DIW 冲洗：
(6)改善干燥：
(7)适用于翘曲基材的宽槽：
(8)定制设备自动化：

1. Metal peeling
2. Chemical plating
3. Uniform etching
4. Minimize the impact of the first wafer
5. Improved DIW flushing
6. Improve drying
7. Wide groove suitable for warped substrates
8. Customized equipment automation